TSV-Aware 3D Physical Design Tool Needs for Faster Mainstream Acceptance of 3D ICs

This article presents several grand challenges in the area of physical design for through-silicon via (TSV) based 3D ICs. Most of these issues are centered around TSVs, which are a new element of the 3D IC layout. Fundamental understanding of the electrical, mechanical, and thermal properties of TSVs is essential in successful physical design of TSV-based 3D ICs. Further investigation of the impact of TSVs on the overall layout qualities such as performance, power, reliability, and manufacturability is crucial. As of early 2010, there is no commercial tool available for automatic placement and routing and sign-off analysis of timing, power, reliability, and manufacturability for TSV-based layouts. This calls for a concerted effort in developing such tools, which will have significant impact on the mainstream acceptance of TSV-based 3D IC technologies and products.